Micro device transfer system with pivot mount

ABSTRACT

A micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

RELATED APPLICATION(S)

This application is a continuation application of U.S. patentapplication Ser. No. 13/715,557, filed on Dec. 14, 2012, now U.S. Pat.No. 9,391,042, which is incorporated herein by reference.

BACKGROUND

Field

The present invention relates to micro devices. More particularly,embodiments of the present invention relate to systems and methods fortransferring a micro device from a carrier substrate.

Background Information

The feasibility of commercializing miniaturized devices such as radiofrequency (RF) microelectromechanical systems (MEMS) microswitches,light-emitting diode (LED) display systems, and MEMS or quartz-basedoscillators is largely constrained by the difficulties and costsassociated with manufacturing those devices. Manufacturing processestypically include wafer based processing and transferring techniques.

Device transferring processes include transfer from a transfer wafer toa receiving wafer. One such implementation is “direct printing”involving one bonding step of an array of devices from a transfer waferto a receiving wafer, followed by removal of the transfer wafer. Anothersuch implementation is “transfer printing” involving twobonding/de-bonding steps. In transfer printing a transfer wafer may pickup an array of devices from a donor wafer and bond the devices to areceiving wafer. Following transfer, the transfer wafer may be removedusing techniques that include laser lift-off (LLO), grinding orpolishing, and etching.

Gimbal mechanisms have been used in wafer polishing equipment tofacilitate evenly polishing a wafer. For example, passive gimbalmechanisms in polishing equipment facilitate alignment of wafers with apolishing pad.

SUMMARY OF THE DESCRIPTION

A micro pick up array mount and methods of using the micro pick up arraymount to transfer an array of micro devices from a carrier substrate aredisclosed. In an embodiment, the micro pick up array mount includes apivot platform, a base laterally around the pivot platform, and a beambetween the pivot platform and the base. The beam may be coupled withthe pivot platform at an inner pivot and coupled with the base at anouter pivot. In an embodiment, the outer pivot is on a base edge and theinner pivot is on a pivot platform edge. The base edge may be orthogonalto the pivot platform edge. In an embodiment, a second beam may becoupled with the base by a second outer pivot on a second base edge andcoupled with the pivot platform by a second inner pivot on a secondpivot platform edge. In an embodiment, the beam is coupled with thepivot platform at a second inner pivot and coupled with the base at asecond outer pivot. The inner pivot may be across the pivot platformfrom the second inner pivot, and the outer pivot may be across the pivotplatform from the second outer pivot. In an embodiment, the inner pivotsand the outer pivots comprise silicon.

In an embodiment, the micro pick up array mount includes a pivotplatform electrostatic voltage source contact on the pivot platform anda base electrostatic voltage source contact on the base. The pivotplatform electrostatic voltage source contact may be in electricalconnection with the base electrostatic voltage source contact. The micropick up array mount may also include a trace extending from the pivotplatform electrostatic voltage source contact and placing the pivotplatform electrostatic voltage source contact may be in electricalconnection with the base electrostatic voltage source contact.

In an embodiment, the micro pick up array mount includes a bonding siteon the pivot platform. The bonding site may include a clamp electrode inelectrical connection with a base clamp contact on the base. In anembodiment, a trace extends from the clamp electrode and places theclamp electrode in electrical connection with the base clamp contact. Inan embodiment, the bonding site may include a metal such as gold,copper, and aluminum.

In an embodiment, the micro pick up array mount includes a heatingcontact on the base and a heating element over the pivot platform inelectrical connection with the heating contact. The micro pick up arraymount may also include a temperature sensor on the pivot platform.

A micro device transfer system and methods of using the micro devicetransfer system to transfer an array of micro devices from a carriersubstrate are disclosed. In an embodiment, the micro device transfersystem includes a micro pick up array mount having a pivot platform, abase laterally around the pivot platform, and a beam between the pivotplatform and the base. The beam may be coupled with the pivot platformat an inner pivot and coupled with the base at an outer pivot. The microdevice transfer system may also include a micro pick up array having asubstrate supporting an array of electrostatic transfer heads. The micropick up array may be joinable with the micro pick up array mount. In anembodiment, the outer pivot may be on a base edge and the inner pivotmay be on a pivot platform edge. The base edge may be orthogonal to thepivot platform edge. In an embodiment, the micro device transfer systemincludes a second beam coupled with the base by a second outer pivot ona second base edge and coupled with the pivot platform by a second innerpivot on a second pivot platform edge. In an embodiment, the beam may becoupled with the pivot platform at a second inner pivot and coupled withthe base at a second pivot. The inner pivot may be across the pivotplatform from the second inner pivot, and the outer pivot may be acrossthe pivot platform from the second outer pivot. In an embodiment, theinner pivots and the outer pivots include silicon. In an embodiment,each electrostatic transfer head comprises a mesa structure including atop surface having a surface area in a range of 1 to 10,000 squaremicrometers.

In an embodiment, the micro device transfer system includes the micropick up array having an electrode and a substrate electrostatic voltagesource contact on the substrate. The substrate electrostatic voltagesource connection may be in electrical connection with the electrode. Inan embodiment, the micro device transfer system includes the micro pickup array mount having a pivot platform electrostatic voltage sourcecontact on the pivot platform and a base electrostatic voltage sourcecontact on the base. The pivot platform electrostatic voltage sourcecontact may be in electrical connection with the base electrostaticvoltage source contact. The micro pick up array mount may also include afirst trace extending from the pivot platform electrostatic voltagesource contact and placing the pivot platform electrostatic voltagesource contact in electrical connection with the base electrostaticvoltage source contact. Furthermore, the micro pick up array may alsoinclude a second trace extending from the substrate electrostaticvoltage source contact and placing the substrate electrostatic voltagesource contact in electrical connection with the electrode through thesecond trace. The substrate electrostatic voltage source contact mayalign with the pivot platform electrostatic voltage source contact toplace the electrode in electrical connection with the base electrostaticvoltage source contact.

In an embodiment, the micro device transfer system may include a baseclamp contact on the base and in electrical connection with a clampelectrode on the pivot platform. The micro device transfer system mayalso include a trace extending from the clamp electrode and placing theclamp electrode in electrical connection with the base clamp contact.The clamp electrode may align with the substrate to electrostaticallybond the micro pick up array to the pivot platform when voltage isapplied to the clamp electrode from the base clamp contact through thetrace. In an embodiment, the micro pick up array may attach to the pivotplatform by a permanent bond, such as by a thermocompression bond.

In an embodiment, the micro device transfer system includes a heatingcontact on the base and a heating element over the pivot platform inelectrical connection with the heating contact. The micro pick up arraymount may also include a temperature sensor on the pivot platform.

A micro device transfer system and methods of using the micro devicetransfer system to transfer an array of micro devices from a carriersubstrate are disclosed. In an embodiment, the micro device transfersystem includes a transfer head assembly having a mounting surface. Themicro device transfer system may also include a micro pick up arraymount having a pivot platform, a base laterally around the pivotplatform, and a beam that connects the base with the pivot platform, anda micro pick up array having a substrate supporting an array ofelectrostatic transfer heads. In an embodiment, the pivot platform maybe deflectable toward the transfer head assembly when the base ismounted on the mounting surface and the micro pick up array is mountedon the pivot platform. In an embodiment, the transfer head assemblyincludes a sensor to detect deflection of the pivot platform toward thetransfer head assembly. For example, the sensor may be a contact sensorto sense a deflected position of the pivot platform and the contactsensor can include a switch. Alternatively, the sensor may be a motionsensor to sense movement of the pivot platform.

In an embodiment, the micro device transfer system may include thetransfer head assembly having an electrostatic voltage sourceconnection, the micro pick up array mount having a pivot platformelectrostatic voltage source contact and a base electrostatic voltagesource contact, and the micro pick up array having a substrateelectrostatic voltage source contact. The electrostatic voltage sourceconnection may be aligned with the base electrostatic voltage sourcecontact and the pivot platform electrostatic voltage source contact maybe aligned with the substrate electrostatic voltage source contact.

In an embodiment, the micro device transfer system includes the transferhead assembly having a vacuum port coupled with a vacuum source to applysuction to the micro pick up array mount. In an embodiment, the transferhead assembly may have a clamping voltage source connection. The micropick up array mount may have a clamp electrode on the pivot platform toapply an electrostatic force to the micro pick up array. In anembodiment, the micro pick up array mount may have a base clamp contacton the base in electrical connection with the clamp electrode. The micropick up array mount may also have a trace extending from the clampelectrode and placing the clamp electrode in electrical connection withthe base clamp contact. The clamp voltage source connection may bealigned with the base clamp contact and the substrate may be alignedwith the clamp electrode to electrostatically bond the micro pick uparray to the pivot platform when voltage is applied to the clampelectrode from the clamping voltage source connection through the baseclamp.

In an embodiment, the micro device transfer system includes the transferhead assembly having a holding electrode coupled to an electrostaticvoltage source to apply an electrostatic force to the micro pick uparray mount and a clamping voltage source connection. Furthermore, themicro device transfer system may include the micro pick up array mounthaving a clamp electrode on the pivot platform to apply andelectrostatic force to the micro pick up array. The micro pick up arraymount may have a base clamp contact on the base in electrical connectionwith a clamp electrode on the pivot platform. The micro pick up arraymount may have a trace extending from the clamp electrode to place theclamp electrode in electrical connection with the base clamp contact.The clamp voltage source connection may be aligned with the base clampcontact and the substrate may be aligned with the clamp electrode toelectrostatically bond the micro pick up array to the pivot platformwhen voltage is applied to the clamp electrode from the clamping voltagesource connection through the base clamp.

In an embodiment, each electrostatic transfer head includes a mesastructure having a top surface with a surface area in a range of 1 to10,000 square micrometers. In an embodiment, the micro pick up array isattached to the pivot platform by a permanent bond that includes athermocompression bond.

In an embodiment, the micro device transfer system includes the transferhead assembly having a heating connection and the micro pick up arraymount having a heating contact on the base and a heating element overthe pivot platform in electrical connection with the heating contact.

In an embodiment, a method includes moving a transfer head assemblytoward a carrier substrate and contacting an array of micro devices onthe carrier substrate with a micro pick up array having an array ofelectrostatic transfer heads. The micro pick up array may be mounted ona micro pick up array mount and the micro pick up array mount may bemounted on the transfer head assembly. The method may further includedeflecting a pivot platform of the micro pick up array mount toward thetransfer head assembly, sensing deflection of the pivot platform,stopping relative movement between the transfer head assembly and thecarrier substrate, applying a voltage to the array of electrostatictransfer heads to create a grip pressure on the array of micro devices,and picking up the array of micro devices from the carrier substrate. Inan embodiment, the method includes moving the transfer head assemblytoward the pivot platform after sensing deflection and before stoppingrelative movement. In an embodiment, the method includes stoppingrelative movement between the transfer head assembly and the carriersubstrate may occur after sensing deflection of the pivot platform witha plurality of sensors. In an embodiment, the method includes moving thetransfer head assembly toward the carrier substrate for a set distanceafter sensing deflection of the pivot platform. In an embodiment, themethod includes stopping relative movement between the transfer headassembly and the carrier substrate immediately in response to sensingdeflection of the pivot platform. In an embodiment, the method includesactuating the transfer head assembly to further align the pivot platformto a plane of the carrier substrate by tipping or tilting the transferhead assembly after sensing deflection of the pivot platform. In anembodiment, the method includes applying heat to the array ofelectrostatic transfer heads while picking up the array of microdevices.

In an embodiment, a method includes moving a transfer head assemblytoward a receiving substrate and contacting the receiving substrate withan array of micro devices carried by a micro pick up array. The micropick up array may have an array of electrostatic transfer heads and bemounted on a micro pick up array mount that is mounted on the transferhead assembly. The method may also include deflecting a pivot platformof the micro pick up array mount toward the transfer head assembly,sensing deflection of the pivot platform, stopping relative motionbetween the transfer head assembly and the receiving substrate, removinga voltage from the array of electrostatic transfer heads, and releasingthe array of micro devices onto the receiving substrate. In anembodiment, the method includes moving the transfer head assembly towardthe pivot platform after sensing deflection and before stopping relativemovement. In an embodiment, the method includes stopping relativemovement between the transfer head assembly and the receiving substrateafter sensing deflection of the pivot platform with a plurality ofsensors. In an embodiment, the method includes moving the transfer headassembly toward the receiving substrate for a set distance after sensingdeflection of the pivot platform. In an embodiment, the method includesstopping relative movement between the transfer head assembly and thereceiving substrate immediately in response to sensing deflection of thepivot platform. In an embodiment, the method includes stopping relativemovement between the transfer head assembly and the receiving substrateimmediately in response to sensing deflection of the pivot platform. Inan embodiment, the method includes actuating the transfer head assemblyto further align the pivot platform to a plane of the receivingsubstrate by tipping or tilting the transfer head assembly after sensingdeflection of the pivot platform. In an embodiment, the method includesapplying heat to the array of micro devices before removing the voltagefrom the array of electrostatic transfer heads.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustration of a mass transfer tool inaccordance with an embodiment of the invention.

FIG. 2 is a side view illustration of a micro device transfer systemincluding a transfer head assembly holding a micro pick up array mountwith a micro pick up array mounted on the micro pick up array mount inaccordance with an embodiment of the invention.

FIG. 3A is a side view illustration of a micro device transfer systemhaving an array of electrostatic transfer heads positioned over andapart from an array of micro devices on a carrier substrate inaccordance with an embodiment of the invention.

FIG. 3B is a side view illustration of a micro device transfer systemhaving an array of electrostatic transfer heads positioned over and incontact with an array of micro devices on a carrier substrate inaccordance with an embodiment of the invention.

FIG. 4A is a perspective view illustration of a micro pick up arraymount having an electrostatic bonding site in accordance with anembodiment of the invention.

FIG. 4B is a side view illustration of a micro pick up array mounthaving an electrostatic bonding site in accordance with an embodiment ofthe invention.

FIG. 4C is a perspective view illustration of a micro pick up arraymount having an electrostatic bonding site in accordance with anembodiment of the invention.

FIG. 4D is a perspective view illustration of a micro pick up arraymount having an electrostatic bonding site in accordance with anembodiment of the invention.

FIG. 4E is a side view illustration of a micro pick up array mounthaving an electrostatic bonding site in accordance with an embodiment ofthe invention.

FIG. 5A is a perspective view illustration of a micro pick up arraymount having a non-electrostatic bonding site in accordance with anembodiment of the invention.

FIG. 5B is a perspective view illustration of a micro pick up arraymount having a non-electrostatic bonding site in accordance with anembodiment of the invention.

FIG. 6A is a perspective view illustration of a micro pick up arraymount having a beam laterally around a pivot platform and anauto-aligning behavior in accordance with an embodiment of theinvention.

FIG. 6B is a perspective view illustration of a micro pick up arraymount having two beams laterally around a portion of a pivot platformand an auto-aligning behavior in accordance with an embodiment of theinvention.

FIG. 6C is a perspective view illustration of a micro pick up arraymount having four beams between a pivot platform and a base, and anauto-aligning behavior, in accordance with an embodiment of theinvention.

FIG. 7 is a side view illustration of a micro pick up array having asubstrate supporting an array of electrostatic transfer heads inaccordance with an embodiment of the invention.

FIG. 8A is a side view illustration of a micro device transfer systemincluding a micro pick up array mount electrostatically bonded with amicro pick up array in accordance with an embodiment of the invention.

FIG. 8B is a side view illustration of a micro device transfer systemincluding a micro pick up array mount electrostatically bonded with amicro pick up array in accordance with an embodiment of the invention.

FIG. 9A is a side view illustration of a micro device transfer systemincluding a micro pick up array mount permanently bonded with a micropick up array in accordance with an embodiment of the invention.

FIG. 9B is a side view illustration of a micro device transfer systemincluding a micro pick up array mount permanently bonded with a micropick up array in accordance with an embodiment of the invention.

FIG. 10A is a cross-sectional side view illustration showing a portionof a micro device transfer system including a transfer head assemblyholding a micro pick up array mount with a micro pick up array mountedon the micro pick up array mount in accordance with an embodiment of theinvention.

FIG. 10B is a cross-sectional side view illustration showing a portionof a micro device transfer system including a transfer head assemblyholding a micro pick up array mount with a micro pick up array mountedon the micro pick up array mount in accordance with an embodiment of theinvention.

FIG. 11 is a perspective view illustration of a transfer head assemblyhaving multiple sensors to detect deflection of a micro pick up arraymount in accordance with an embodiment of the invention.

FIG. 12 is a cross-sectional side view illustration showing a portion ofa micro device transfer system including a transfer head assemblyholding a micro pick up array mount with a micro pick up array mountedon the micro pick up array mount and the transfer head assembly havingmultiple sensors to detect deflection of the micro pick up array mountin accordance with an embodiment of the invention.

FIG. 13 is a cross-sectional side view illustration showing a portion ofa micro device transfer system including a transfer head assemblyholding a micro pick up array mount with a micro pick up array mountedon the micro pick up array mount and the micro pick up array mountdeflected toward sensors on the transfer head assembly in accordancewith an embodiment of the invention.

FIG. 14 is a flowchart illustrating a method of picking up an array ofmicro devices from a carrier substrate in accordance with an embodimentof the invention.

FIG. 15A is a cross-sectional side view illustration of a micro devicetransfer system having a transfer head assembly moving toward a carriersubstrate in accordance with an embodiment of the invention.

FIG. 15B is a cross-sectional side view illustration of a micro devicetransfer system having an array of electrostatic transfer headscontacting an array of micro devices on a carrier substrate inaccordance with an embodiment of the invention.

FIG. 15C is a cross-sectional side view illustration of a micro devicetransfer system having a micro pick up array mount deflecting toward atransfer head assembly in accordance with an embodiment of theinvention.

FIG. 15D is a cross-sectional side view illustration of a micro devicetransfer system having an array of electrostatic transfer heads pickingup an array of micro devices from a carrier substrate in accordance withan embodiment of the invention.

FIG. 16 is a flowchart illustrating a method of releasing an array ofmicro devices onto a receiving substrate in accordance with anembodiment of the invention.

FIG. 17A is a cross-sectional side view illustration of a micro devicetransfer system having a transfer head assembly moving toward areceiving substrate in accordance with an embodiment of the invention.

FIG. 17B is a cross-sectional side view illustration of a micro devicetransfer system having an array of electrostatic transfer heads carryingan array of micro devices contacting a receiving substrate in accordancewith an embodiment of the invention.

FIG. 17C is a cross-sectional side view illustration of a micro devicetransfer system having a micro pick up array mount deflecting toward atransfer head assembly in accordance with an embodiment of theinvention.

FIG. 17D is a cross-sectional side view illustration of a micro devicetransfer system releasing an array of micro devices onto a receivingsubstrate from an array of electrostatic transfer heads in accordancewith an embodiment of the invention.

FIG. 18 is a schematic illustration of an exemplary computer system thatmay be used in accordance with an embodiment of the invention.

DETAILED DESCRIPTION

Embodiments of the present invention describe systems and methods fortransferring a micro device or an array of micro devices from a carriersubstrate. For example, the micro devices or array of micro devices maybe any of the micro LED device structures illustrated and described inrelated U.S. patent application Ser. Nos. 13/372,222, 13/436,260,13/458,932, and Ser. No. 13/625,825. While some embodiments of thepresent invention are described with specific regard to micro LEDdevices, the embodiments of the invention are not so limited and certainembodiments may also be applicable to other micro LED devices and microdevices such as diodes, transistors, ICs, and MEMS.

In various embodiments, description is made with reference to thefigures. However, certain embodiments may be practiced without one ormore of these specific details, or in combination with other knownmethods and configurations. In the following description, numerousspecific details are set forth, such as specific configurations,dimensions, and processes, in order to provide a thorough understandingof the present invention. In other instances, well-known processes andmanufacturing techniques have not been described in particular detail inorder to not unnecessarily obscure the present invention. Referencethroughout this specification to “one embodiment,” “an embodiment”, orthe like, means that a particular feature, structure, configuration, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the invention. Thus, the appearances ofthe phrase “one embodiment,” “an embodiment”, or the like, in variousplaces throughout this specification are not necessarily referring tothe same embodiment of the invention. Furthermore, the particularfeatures, structures, configurations, or characteristics may be combinedin any suitable manner in one or more embodiments.

The terms “over”, “to”, “between” and “on” as used herein may refer to arelative position of one layer with respect to other layers. One layer“over” or “on” another layer or bonded “to” another layer may bedirectly in contact with the other layer or may have one or moreintervening layers. One layer “between” layers may be directly incontact with the layers or may have one or more intervening layers.

The terms “micro” device or “micro” LED structure as used herein mayrefer to the descriptive size of certain devices or structures inaccordance with embodiments of the invention. As used herein, the terms“micro” devices or structures are meant to refer to the scale of 1 to100 μm. However, embodiments of the present invention are notnecessarily so limited, and certain aspects of the embodiments may beapplicable to larger, and possibly smaller size scales. In anembodiment, a single micro device in an array of micro devices, and asingle electrostatic transfer head in an array of electrostatic transferheads both have a maximum dimension, for example length or width, of 1to 100 μm. In an embodiment, the top contact surface of each microdevice or electrostatic transfer head has a maximum dimension of 1 to100 μm. In an embodiment, the top contact surface of each micro deviceor electrostatic transfer head has a maximum dimension of 3 to 20 μm. Inan embodiment, a pitch of an array of micro devices, and a pitch of acorresponding array of electrostatic transfer heads is (1 to 100 μm) by(1 to 100 μm), for example a 20 μm by 20 μm, or 5 μm by 5 μm pitch. Inone aspect, without being limited to a particular theory, embodiments ofthe invention describe micro device transfer heads and head arrays whichoperate in accordance with principles of electrostatic grippers, usingthe attraction of opposite charges to pick up micro devices. Inaccordance with embodiments of the present invention, a pull-in voltageis applied to a micro device transfer head in order to generate a grippressure on a micro device and pick up the micro device.

In one aspect, embodiments of the invention describe systems and methodsfor the mass transfer of micro devices using a micro pick up array mountwith a self-aligning capability. In an embodiment, the micro pick uparray mount may include one or more pivots and beams to allow a mountedmicro pick up array to automatically align to a carrier substrate or areceiving substrate when the system components are brought into contact,e.g., when electrostatic transfer heads supported by the micro pick uparray contact an array of micro devices on the carrier substrate. Thus,the micro pick up array mount facilitates more complete and uniformcontact between the array of electrostatic transfer heads and array ofmicro devices being transferred. In this manner, the self-aligningcapability of the micro pick up array mount may allow for a simpler masstransfer tool design in which an expensive arrangement of sensors (suchas spectral-interference laser displacement meters) and actuators maynot be required for fine-alignment of the micro pick up array with thecarrier or receiving substrate on the micron or sub-micron scale priorto picking up or releasing the array of micro devices. Thus, theself-aligning capability may reduce cost of system components, whilealso increasing the transfer rate of micro devices since fine-alignmentmay be accomplished by the self-aligning capability while picking up andreleasing the array of micro devices.

In another aspect, embodiments of the invention describe systems andmethods for the mass transfer of micro devices using sensors to sensesystem component deflections. A variety of sensors may be employed suchas expensive spectral-interference laser displacement meters, or lessexpensive sensor switches that detect contact between system components.For example, a sensor may detect deflection of a micro pick up arraymount when a mounted micro pick up array contacts a micro device on acarrier substrate, or when a micro device carried by the micro pick uparray contacts a receiving substrate. More specifically, in anembodiment, relative movement between a transfer head assembly and acarrier substrate, or relative movement between the transfer headassembly and a receiving substrate, may be stopped in response to asensed deflection. Movement may stop immediately upon detection, or upona predetermined event following detection. Thus, contact between anarray of micro devices and an array of electrostatic transfer heads or areceiving substrate may be monitored to control pick up and release ofthe array of micro devices.

In yet another aspect, embodiments of the invention describe systems andmethods for the mass transfer of micro devices using system componentshaving electrostatic voltage source connections and contacts that alignto place the system components in electrical connection with each other.In an embodiment, an electrostatic voltage source connection of atransfer head assembly may be placed in electrical connection with anarray of electrostatic transfer heads. More specifically, a voltage maybe supplied from an electrostatic voltage source connection to the arrayof electrostatic transfer heads through various contacts and connectors,e.g., vias and traces, which align to create an operating voltage pathtraversing several components. An operating voltage applied to, e.g., anelectrode of the electrostatic transfer head from the electrostaticvoltage source connection, may allow the electrostatic transfer head toapply a grip pressure to a micro device.

In still another aspect, embodiments of the invention describes systemsand methods for the mass transfer of micro devices using systemcomponents having clamping voltage source connections and contacts thatalign to join the system components with each other. In an embodiment, aclamping voltage source connection of a transfer head assembly may beplaced in electrical connection with a clamp electrode of a micro pickup array mount. More specifically, a voltage may be supplied from aclamping voltage source connection to the micro pick up array throughvarious contacts and connectors, e.g., vias and traces, which align tocreate a clamping voltage path traversing several components. A clampingvoltage applied to the clamp electrode on the micro pick up array mountfrom the clamping voltage source connection may electrostatically hold amicro pickup array against the micro pick up array mount.

In another aspect, embodiments of the invention describe systems andmethods for the mass transfer of micro devices using system componentshaving heating mechanisms to apply heat to an array of micro devices. Inan embodiment, the heating mechanism includes a resistive heatingelement on a micro pick up array mount. Heat may thus be deliveredthrough the micro pick up array mount to one or more electrostatictransfer heads on a micro pick up array mounted on the micro pick uparray mount, and into an array of micro devices gripped by theelectrostatic transfer heads. In this manner, it is possible to transferheat from a micro pick up array mount having a self-aligning capabilityto a micro device carried by the micro pick up array mount withoutexcessively heating portions of the micro pick up array mount.

In yet another aspect, embodiments of the invention describe a mannerfor mass transfer of an array of pre-fabricated micro devices with anarray of electrostatic transfer heads. For example, the pre-fabricatedmicro devices may have a specific functionality such as, but not limitedto, a LED for light-emission, silicon IC for logic and memory, andgallium arsenide (GaAs) circuits for radio frequency (RF)communications. In some embodiments, arrays of micro LED devices whichare poised for pick up are described as having a 20 μm by 20 μm pitch,or 5 μm by 5 μm pitch. At these densities a 6 inch substrate, forexample, can accommodate approximately 165 million micro LED deviceswith a 10 μm by 10 μm pitch, or approximately 660 million micro LEDdevices with a 5 μm by 5 μm pitch. A transfer tool including an array ofelectrostatic transfer heads matching an integer multiple of the pitchof the corresponding array of micro LED devices can be used to pick upand transfer the array of micro LED devices to a receiving substrate. Inthis manner, it is possible to integrate and assemble micro LED devicesinto heterogeneously integrated systems, including substrates of anysize ranging from micro displays to large area displays, and at hightransfer rates. For example, a 1 cm by 1 cm array of electrostatictransfer heads can pick up and transfer more than 100,000 micro devices,with larger arrays of electrostatic transfer heads being capable oftransferring more micro devices.

FIG. 1 is a perspective view illustration of a mass transfer tool fortransferring micro devices from a carrier substrate shown in accordancewith an embodiment of the invention. Mass transfer tool 100 includes atransfer head assembly 206 for picking up a micro device from a carriersubstrate held by a carrier substrate holder 108 and for transferringand releasing the micro device onto a receiving substrate held by areceiving substrate holder 124. A system of actuators operates to movethe transfer head assembly 206 under the control of a computer system150. Furthermore, computer system 150 controls the actuators based onfeedback inputs from various sensors. In some embodiments, mass transfertool 100 may be any of the mass transfer tool embodiments illustratedand described in related U.S. patent application Ser. No. 13/607,031,which is hereby incorporated by reference.

Referring to FIG. 2, a side view illustration of a micro device transfersystem including a transfer head assembly holding a micro pick up arraymount with a micro pick up array mounted on the micro pick up arraymount is shown in accordance with an embodiment of the invention. Microdevice transfer system 200 includes micro pick up array mount 202, micropick up array 204, and transfer head assembly 206. Each of these systemcomponents may be joined. For example, micro pick up array mount 202 maybe retained on a mounting surface 208 of transfer head assembly 206, andmicro pick up array 204 may be retained on a mounting surface 205 of themicro pick up array mount 202. In an embodiment, the components of micropick up array system 200 may be electrically connected, such that anoperating voltage path or clamping voltage path traverses multiplecomponents. These aspects are described further below.

Referring to FIG. 3A, a side view illustration of a micro devicetransfer system having an array of electrostatic transfer headspositioned over and apart from an array of micro devices on a carriersubstrate is shown in accordance with an embodiment of the invention.Micro device transfer system 200 with micro pick up array 204 supportingarray of electrostatic transfer heads 210 may be positioned over andapart from an array of micro devices (not shown) carried on carriersubstrate 302, which is held by carrier substrate holder 108. In aninitial state, micro pick up array 204 and carrier substrate 302 mayhave surfaces that are misaligned by an angle 304. Furthermore, micropick up array 204 is mounted on micro pick up array mount 202. Micropick up array mount 202 includes a pivot platform as described in moredetail in the following description that allows for the self-alignmentof micro pick up array 204 with the array of micro devices on thecarrier substrate 302. Thus, micro pick up array 204 is able to moverelative to transfer head assembly 206.

Referring to FIG. 3B, a side view illustration of a micro devicetransfer system having an array of electrostatic transfer headspositioned over and in contact with an array of micro devices on acarrier substrate is shown in accordance with an embodiment of theinvention. When micro pick up array 204 is moved toward carriersubstrate 302 from the misaligned state shown in FIG. 3A, the array ofelectrostatic transfer heads 210 may contact an array of micro deviceson the carrier substrate 302 unevenly. For example, one side of array ofelectrostatic transfer heads 210 may contact the array of micro deviceswhile another side may not. Alternatively, all of the electrostatictransfer heads 210 may make contact, but the pressure applied throughoutthe array of electrostatic transfer heads may be uneven. However, asdescribed below, the forces imparted to array of electrostatic transferheads 210 may tip and tilt the pivot platform, allowing array ofelectrostatic transfer heads 210 to align with the array of microdevices on carrier substrate 302. That is, the pivot platform may rotateand translate about and along multiple axes to align with the contactingsurface, e.g., carrier substrate 302, such that complete and uniformcontact is achieved.

Since the pivot platform self-aligns, pressure and/or contactdistribution throughout micro pick up array 204 may be substantiallyuniform. Uniform pressure distribution can include even pressure and/orcontact between the electrostatic transfer heads 210 and the microdevices on carrier substrate 302. Such uniform pressure or contact mayavoid damage to electrostatic transfer heads 210 or micro devices and itmay enable the contact and transfer of all, or nearly all, of the microdevices.

Referring now to FIG. 4A, a perspective view illustration is shown of amicro pick up array mount having an electrostatic bonding site inaccordance with an embodiment of the invention. Micro pick up arraymount 202 may be joined with, and placed between, micro pick up array204 and transfer head assembly 206, allowing relative movement betweenthose components. Relative movement of 204/206 may result in automaticalignment of the array of electrostatic transfer heads 210 with an arrayof micro devices on a carrier substrate. As a result, the electrostatictransfer heads 210 may contact every corresponding micro device of thearray of micro devices with uniform pressure.

In the embodiment illustrated, micro pick up array mount 202 includesbase 402 and pivot platform 404. In an embodiment, base 402 surroundsall or a part of pivot platform 404. For example, base 402 may extendlaterally around pivot platform 404, as illustrated. In an alternativeembodiment, base 402 does not surround pivot platform 404. Base 402 andpivot platform 404 may be interconnected by one or more beams 406. Eachbeam 406 may connect with base 402 and pivot platform 404 at one or morepivot locations, such as inner pivot 408, 414 and outer pivot 410, 416.

FIG. 4A shows both base 402 and pivot platform 404 having rectangularperimeters, however base 402 and pivot platform 404 may be shapeddifferently. For example, base 402 may be circular, hexagonal, oval,etc., without departing from the scope of this disclosure. Likewise,pivot platform 404 may be alternatively shaped. For example, pivotplatform 404 may be circular, hexagonal, oval, etc. In an embodiment,base 402 and pivot platform 404 have conforming shapes, such that pivotplatform 404 is nestled within the base 402 of the same shape. In otherembodiments, base 402 and pivot platform 404 do not have conformingshapes. For example, base 402 may be circular and pivot platform 404 maybe rectangular, resulting in additional gaps near the midpoint of eachside of pivot platform 404. Such mismatch may allow for beams 406 to beextended within the gap areas in order to provide larger bending arms,in accordance with the following disclosure.

Still referring to FIG. 4A, beam 406 may extend from inner pivot 408 toouter pivot 410 laterally around pivot platform 404. More particularly,beam 406 may conform to base 402 and pivot platform 404 by fittingbetween those components and substantially filling a void between thosecomponents. In at least one embodiment, the lateral extension of beam406 provides a lever arm that allows adequate bending in beam 406 andtorsion in pivots 408 and 410 to enable relative movement between base402 and pivot platform 404 when forces are applied to those components.Bending in beam 406 includes a component orthogonal to base 402, e.g., az-direction component along axis 474.

In an embodiment, the pivots of micro pick up array mount 202 arepositioned to twist about multiple axes. For example, inner pivot 408 ispositioned on pivot platform 404 at an edge that is orthogonal to anedge of base 402 on which outer pivot 410 is positioned. Thus, axes suchas axis 470 and axis 472 running perpendicular to the edges that innerpivot 408 and outer pivot 410 are positioned on, are also orthogonal toeach other. Resultantly, pivot platform 404 and base 402 may twistrelative to each other along axes 470 and 472. For example, pivotplatform 404 can twist in a direction θ_(x) about axis 470, relative tobase 402. Additionally, pivot platform 404 can twist in a directionθ_(y) about axis 472, relative to base 402.

Micro pick up array mount 202 may include pairs of pivots along an axisof torsion. For example, micro pick up array mount 202 may include innerpivot 414 positioned across pivot platform 404 from inner pivot 408.Thus, pivot platform 404 may be supported along opposite sides by beam406 at inner pivots 408 and 414. Furthermore, pivot platform 404 mayrotate about an axis, e.g., axis 472 running through inner pivot 408 andinner pivot 414 when a force is applied to the pivot platform offsetfrom the axis. For example, pivot platform 404 may rotate in a directionθ_(y) about axis 472 when a force is applied to beam 406 near outerpivot 410. Likewise, micro pick up array mount 202 may include outerpivot 416 positioned across pivot platform 404 from outer pivot 410.Thus, the beam 406 connecting pivot platform 404 with base 402 may besupported along opposite sides by base 402 at outer pivots 410 and 416.Furthermore, pivot platform 404 may rotate about an axis, e.g., axis470, running through outer pivot 410 and outer pivot 416 when a force isapplied to the pivot platform offset from the axis. For example, pivotplatform 404 may rotate in a direction θ_(x) about axis 470 when a forceis applied to beam 406 near inner pivot 408. Thus, pivots of micro pickup array mount 404 facilitate movement and automatic alignment betweenthe base 402 and pivot platform 404. The kinematics of micro pick uparray mount 202 will be described further below.

In accordance with embodiments of the invention, micro pick up arraymount 202 may be formed from one or more portions or parts. Severalmaterials may be utilized for the micro pick up array mount 202.Material selection for the micro pick up array mount is driven by thecapability to deflect under applied load, thermal stability, and minimalspring mass. Table 1 lists relevant material properties for severalcandidate materials including silicon, silicon carbide, aluminumnitride, stainless steel, and aluminum.

TABLE 1 Yield Flexure Modulus Strength Ratio CTE Density Material (GPA)(MPa) (×10e−3) (ppm/° C.) (kg/m³) Silicon 165 2000 12.1 2.6 2400 SiliconCarbide 410 550 1.3 4.0 3100 Aluminum 320 320 1.0 4.5 3260 NitrideStainless Steel 190 600 3.2 14 8240 316 Aluminum 70 47 0.7 23 2700

Although each of the listed materials may be used for the micro pick uparray mount, silicon has the largest flexure ratio, lowest CTE, andlowest density of the candidate materials. In addition, silicon may beformed with a variety of precision semiconductor manufacturingtechniques.

Thus, in an embodiment, base 402, pivot platform 404, and beam 406 areformed from a silicon wafer to produce distinct regions. Morespecifically, known processes, such as deep etching, laser cutting, etc.may be used to form channels 412. In at least one embodiment, channels412 may therefore define the structure of micro pick up array mount 202by providing separations between, e.g., base 402 and pivot platform 404regions.

Referring to FIGS. 4A-4B, micro pick up array mount 202 may include oneor more pivot platform electrostatic voltage source contacts 420 onpivot platform 404. Electrostatic voltage source contacts 420 mayfunction to transfer the operating voltage to the array of electrostatictransfer heads on the micro pick up array 204 when operably connectedwith the micro pick up array mount 202. In an embodiment, electrostaticvoltage source contact(s) 420 are formed using a suitable technique suchas, but not limited to, sputtering or electron beam evaporation of aconductive material (e.g., metal) onto a surface of pivot platform 404.Referring now to FIG. 4B, pivot platform each electrostatic voltagesource contact 420 may further be placed in electrical connection with alanding pad 431 of a via structure 422, which extends through the micropick up array mount 202 to base electrostatic voltage source contact433. Furthermore, and more particularly, pivot platform electrostaticvoltage source contact 420 may be placed in electrical connection withvia 422 through trace 424. Trace 424 connects pivot platformelectrostatic voltage source contact 420 to landing pad 431. As shown,trace 424 may run over one or more of the portions on the micro pick uparray mounting side of micro pick up array mount 202. For example, trace424 may run over base 402, beam 406, and pivot platform 404. Trace 424may also be formed using a suitable technique such as sputtering ore-beam evaporation. In an embodiment, electrostatic voltage sourcecontacts 420, landing pads 431, and traces 424 are simultaneouslyformed. In an embodiment, trace 424 may be a wire that is separate from,or bonded to a surface of, micro pick up array mount 202, and whichelectrically connects pivot platform electrostatic voltage sourcecontact 420 with landing pad 431.

Micro pick up array mount 202 may further include an arrangement ofdummy traces 425 on the same side of the micro pick up array mount 202as traces 424. As illustrated in FIG. 4A, dummy traces 425 may mirrorthe arrangement of traces 424 on portions of the beams 406 or pivotplatform 404 in order to balance residual and thermal stresses in micropick up array mount 202. More specifically, residual stresses from thefabrication of micro pick up array mount 202 depend in part on thecomposite structural characteristics of beams 406. Traces 424 alongbeams 406 contribute to these characteristics, and residual stressescaused by, e.g., the cooling of beams 406 during fabrication, maytherefore be different in beams 406 having traces 424 than beams 406without traces 424. This difference may result in, e.g., skewing of theself-aligning structure at ambient conditions. Alternatively, or inconjunction with these residual stresses, when heat is applied to micropick up array mount 202, beams 406 with traces 424 may behavedifferently, e.g., expand at a different rate, than beams 406 withouttraces 424. Again, this may distort the micro pick up array structure.Dummy traces 425 give beams 406 without traces 424 similar compositestructural characteristics as beams 406 with traces 424. Thus, dummytraces 425 can balance or offset residual and thermal stressesthroughout all of the beams 406 to avoid distortion of micro pick uparray mount 202.

Micro pick up array mount 202 may include one or more bonding sites tomount the micro pick up array 204 on the micro pick up array mount 202.In an embodiment, a bonding site includes one or more clampingelectrodes 430 located on a micro pick up array mounting surface 205 ofpivot platform 404. More particularly, the clamping electrodes 430 maybe located on the same surface of pivot platform 404 on which pivotplatform electrostatic voltage source contacts 420 are located. In anembodiment, the clamping electrodes 430 are formed simultaneously withelectrostatic voltage source contacts 420, landing pads 431, and traces424. Clamp electrodes 430 may further be placed in electrical connectionwith a via structure 432, which extends through the micro pick up arraymount 202. In the embodiment illustrated, the via structure 432 extendsthrough the micro pick up array mount 202 to a landing pad 441 on a backsurface, which is in electrical connection with a base clamp contact 442by a trace 434. As shown, trace 434 may run over one or more portions ofthe backside surface of micro pick up array mount 202 which connectswith the transfer head assembly. For example, trace 434 may run overbase 402, beam 406, and pivot platform 404. Furthermore, in anembodiment, trace 434 may be a wire that is separate from, or bonded toa surface of, micro pick up array mount 202, and which electricallyconnects base clamp contact 442 with via 432 and clamp electrode 430.

Electrical components of micro pick up array mount 202 may be formed innumerous manners. For example, vias 422, 432 may be formed by drillingor etching a hole through base 402, passivating the hole with aninsulator, and forming a conductive material (e.g., metal) into thepassivated hole to form via 422, 432 using a suitable technique such assputtering, e-beam evaporation, electroplating, or electrolessdeposition.

In some embodiments, micro pick up array mount 202 may further beconstructed to be secured or clamped to the transfer head assembly 206with electrostatic principles. As shown in the embodiment illustrated inFIGS. 4A-4E and FIG. 8A-10B, one or more clamp areas 450 may be formedon the backside of the micro pick up array mount 202 to align with theclamp electrodes 1010 of the transfer head assembly 206. In accordancewith the principles of electrostatic grippers, using the attraction ofopposite charges, a dielectric layer may be formed over the clampelectrodes 1010 and/or the clamp areas 450. Clamp areas 450 can beformed by a variety of methods and assume a variety of configurations.In one embodiment, clamp areas 450 are conductive pads, such as a metalor semiconductor film, formed on the back surface of the micro pick uparray mount 202. The conductive pads may be electrically isolated fromthe other active regions of the micro pick up array mount 202. Forexample, insulating layers may be formed under, over, and around theconductive pads.

Referring to FIG. 4C, a perspective view illustration of a micro pick uparray mount having an electrostatic bonding site is shown in accordancewith an embodiment of the invention. In some embodiments, micro pick uparray mount 202 may include a heating contact 480 placed on base 402.For example, heating contact 480 can be adjacent to clamp area 450 onthe bottom surface of micro pick up array mount 202 to align with orotherwise be placed in electrical connection with a heating connection1090 (FIGS. 10A-10B) of transfer head assembly 206. Multiple heatingcontacts 480 may be used, for example, to pass current through one ormore heating elements 484. More specifically, heating element 484 mayextend from a first heating contact 480 and over pivot platform 404and/or beams 406 before terminating at, e.g., a second heating contact480. Thus, heating element 484 can carry electrical current betweenmultiple heating contacts 480. As current passes through heating element484, Joule heating causes the temperature of heating element 484 torise.

In an embodiment, heating element 484 may be connected with heatingcontacts 480 by one or more heating leads 482. Heating lead 482 can besized and configured to dissipate less heat than heating element 484,and thus, act as an electrical lead to carry electrical current fromheating contacts 480 over portions of micro pick up array mount 202,e.g., base 402 and beams 406, without heating those portionssignificantly. For example, heating lead 482 may be a copper conductor.In this manner, heating of micro pick up array mount 202 can be isolatedto areas having heating element 484, such as pivot platform 404.

Heating element 484 may be formed from a material and shape that isconducive to resistive heating. More particularly, heating element 484can be formed to generate heat when an electrical current is passedthrough it. As an example, heating element 484 can be formed from a wirestrand of molybdenum disilicide. The wire strand can be coiled orsinuously placed on the micro pick up array mount 202 to uniformlydistribute heat across or throughout a surface or structure, e.g., pivotplatform 404. Heating element 484 may be insulated, for example bylaminating over the element, to protect adjacent components fromexcessive heating and to direct heat into pivot platform 404.

In an embodiment, micro pick up array mount 202 includes a temperaturesensor to sense the temperature of micro pick up array mount 202 ornearby structures, e.g., a micro pick up array. For example, temperaturesensor 440 may be located on the pivot platform to measure thetemperature of the pivot platform 404. Temperature sensor 440 may bepotted or otherwise adhered or mechanically fixed to the pivot platform.In another embodiment, temperature sensor 440 may be located in a centerof pivot platform 404 (FIG. 4A), a corner of pivot platform 404 (FIG.5A), or on base 402 or beam 406. In still other embodiments, temperaturesensor 440 can be located on a front or back surface of pivot platform404, i.e., on a surface having landing pad 431 or on an opposing surfacehaving landing pad 441. The choice of location can be driven byconsiderations such as available space and whether the temperaturesensor 440 will interfere with other functions, such as whether it willdisrupt electrical charge in the electrostatic transfer heads 210. Forexample, in an embodiment, temperature sensor 440 may be centered on theback surface of pivot platform 404 where the sensor will notmechanically interfere with bonding of the micro pick up array 204. Thetemperature sensor 440 may be centered on platform 404 to closelyapproximate the peak temperature of micro pickup array 204. Temperaturevariations due to convective heat loss may skew the measured temperatureif sensor 440 is located in close proximity to the edge of pivotplatform 404. Temperature sensor 440 may be any of a variety of knowntemperature sensors, such as junction-type thermocouples, resistancetemperature detectors, etc.

Referring to FIGS. 4D-4E, in an embodiment, micro pick up array mount202 includes base electrostatic voltage source contact 433 and baseclamp contact 442 located on a same surface of micro pick up array mount202. For example, base electrostatic voltage source contact 433 and baseclamp contact 442 can be located on a same side of micro pick up arraymount 202 that electrostatic voltage source contacts 420 and clampingelectrodes 430 are located. Furthermore, traces 424 can interconnectbase electrostatic voltage source contact 433 and base clamp contact 442with electrostatic voltage source contacts 420 and clamping electrodes430, respectively. Since the interconnected connections and contacts maybe located on a same side of micro pick up array mount 202, there is noneed for vias 422, 432. More particularly, traces 424 can run along thesame side of micro pick up array mount 202 and over each of beams 406 ina symmetric pattern that balances the weight of traces 424 across beams406.

In an embodiment, given that base electrostatic voltage source contact433 and base clamp contact 442 may be located on, e.g., the top surfaceof base 402, base electrostatic voltage source contact 433 and baseclamp contact 442 may be adjacently placed and connected with a separateelectrical lead that extends to or from transfer head assembly 206. Forexample, ribbon cable 460 having wires to make electrical connectionbetween micro pick up array mount 202 and transfer head assembly 206 canbe engaged with an insulation-displacement connector in electricalconnection with base electrostatic voltage source contact 433 and baseclamp contact 442. Therefore, voltage can be applied to baseelectrostatic voltage source contact 433 and base clamp contact 442through ribbon cable 460 from an external component, such as thetransfer head assembly 206.

Referring now to FIG. 5A, a perspective view illustration of a micropick up array mount having a non-electrostatic bonding site is shown inaccordance with an embodiment of the invention. Most components of themicro pick up array mount 202, such as pivot platform electrostaticvoltage source contact 420 may be the same or similar to theircounterparts in the embodiment of FIG. 4A-4B. However, in thisembodiment, the clamping electrodes 430 are replaced with bonding pad500. Bonding pad 500 may be formed of a variety of materials includingpolymers, solders, metals, and other adhesives to facilitate theformation of a permanent bond with another structure. In an embodiment,bonding pad 500 may include gold, copper, or aluminum to facilitate theformation of a thermocompression bond with an adjacent structure. Forexample, a gold-to-gold thermocompression bond may be formed betweenbonding pad 500 and an adjacent structure. However, a thermocompressionbond is only one manner of forming a permanent bond between structures,and thus, bonding pad 500 may include other materials or mechanisms thatfacilitate the formation of a bond between the micro pick up array mount202 and another part or structure. For example, direct bonding, adhesivebonding, reactive bonding, soldering, etc., may be used at numerousbonding sites having various shapes and sizes.

Referring to FIG. 5B, a perspective view illustration of a micro pick uparray mount having a non-electrostatic bonding site is shown inaccordance with an embodiment of the invention. In an embodiment, micropick up array mount 202 can include ribbon cables 460 in electricalcommunication with base electrostatic voltage source contact 433. Asdiscussed above, ribbon cables 460 can be electrically connected with anexternal component, such as an electrostatic voltage source of thetransfer head assembly, which may eliminate the need for via 422 todeliver voltage to base electrostatic voltage source contact 433.

As shown in FIGS. 4A-4E, micro pick up array mount 202 may includeheating element 484 disposed on a pivot platform surface opposite fromelectrostatic voltage source contacts 420 and clamping electrodes 430.Thus, heat may be delivered through pivot platform 404 to electrostaticvoltage source contacts 420 and clamping electrodes 430 or to a micropick up array in contact with those contacts.

Referring now to FIG. 6A, a perspective view illustration of a micropick up array mount having a beam laterally around a pivot platform andan auto-aligning behavior is shown in accordance with an embodiment ofthe invention. As described above, micro pickup array mount 202 permitsmovement between platform 404 and base 402 along and about multiple axesas a result of bending of beams 406 and torsion of pivots 408, 410, 414,and 416. Bending of beams 406 can include a z-vector component, such asa component in the direction of axis 630. Furthermore, pivot platform404 may rotate about a first axis 602 due to twist in inner pivots 408,414 and about axis 604 due to twist in outer pivots 410, 416. Movementof pivot platform 404 in alternate planes is achieved through bending ofbeam 406. For example, bending of beam 406 between inner pivot 414 andouter pivots 416 may cause pivot platform 404 to tilt away from theorientation shown in FIG. 6A. Furthermore, bending of beam 406 may allowpivot platform 404 to translate in different directions, such as alongaxis 630. Thus, pivot platform 404 may self-align to another surface bytipping, tilting, rotating, and translating from its original positionrelative to base 402.

Translation of pivot platform 404 along axis 630 allows pivot platform404 to move relative to base 402, when base 402 remains fixed. In otherwords, movement of pivot platform 404 may result in an expansion, ortelescoping, of micro pick up array mount 202 in the direction of axis630. This expansion may be defined by the deflection, or translation, ofpivot platform 404 along axis 630. In an embodiment, the potentialamount of deflection relates to the degree of misalignment that may beaccommodated between a micro pick up array and a carrier substrate, aswill be more fully described below. Thus, in an embodiment, the range ofmotion of pivot platform 404 along axis 630 relative to base 402 may bein a range of about 1 to 30 micrometers. In another embodiment, therange of motion may be in a range of about 2 to 10 micrometers. Evenmore particularly, in an embodiment, pivot platform 404 may deflectapproximately 10 micrometers away from base 402 along axis 630.

Referring now to FIG. 6B, a perspective view illustration of a micropick up array mount having two beams laterally around a portion of apivot platform and an auto-aligning behavior is shown in accordance withan embodiment of the invention. Micro pick up array mount 202 includesbase 402 structurally connected with pivot platform 404 by beams 406 and406′. Thus, in an embodiment, the beams 406 may be discontinuous and notcompletely laterally surround pivot platform 404. More specifically,pivot platform 404 may be supported at one side by beam 406 connectedwith pivot platform 404 and base 402 at inner pivot 414 and outer pivot416, respectively. Similarly, pivot platform 404 may be supported at anopposite side by beam 406′ connected with pivot platform 404 and base402 at inner pivot 414′ and outer pivot 416′. Alternative structurestill allows for pivot platform 404 to tip and tilt relative to base402. More specifically, pivot platform 404 is able to rotate about axis602 due to twisting in inner pivots 414, 414′, as well as rotate aboutaxis 604 due to twisting in outer pivots 416, 416′. Furthermore, bendingin beams 406, 406′ allow pivot platform to tilt in various other planesor translate along axes, e.g., 630. Thus, pivot platform 404 mayself-align to another surface by tipping and tilting from its originalposition relative to base 402.

Referring now to FIG. 6C, a perspective view illustration of a micropick up array mount having four beams between a pivot platform and abase, and an auto-aligning behavior, is shown in accordance with anembodiment of the invention. Micro pick up array mount 202 includes base402 structurally connected with pivot platform 404 by beams 606, 608,610, and 612. Thus, in an embodiment, multiple beams may support pivotplatform 404. As shown, each beam may have a substantially linearconfiguration, such that a single beam supports each side of pivotplatform 404. Beams 606, 608, 610, and 612 may extend diagonally betweenpivot platform 404 and base 402 to provide a substantial moment orbending arm, but the beams may also extend orthogonally from pivotplatform 404, thereby minimizing the beam length. The multiple linearbeam structure also permits pivot platform 404 to tip and tilt relativeto base 402 in a manner similar to that discussed above. However, themechanics of motion may be different from other embodiments, in that thelinear beams may result in a stiffer structure. Thus, pivot platform 404may still rotate about axis 602 or translate along axis 630, forexample, but the degree of movement may be less per unit force appliedas opposed to some of the preceding structural embodiments. Nonetheless,pivot platform 404 may self-align to another surface by tipping andtilting from its original position relative to base 402.

The preceding structural embodiments of micro pick up array mount 202are intended to show the breadth of potential embodiments that arecontemplated within the scope of this disclosure. Accordingly, theseembodiments are in no way intended to be exhaustive, but are ratherintended to suggest to one skilled in the art that a variety of beamstructures and pivot configurations and placement may be used to achievea self-aligning structure in which pivot platform 404 may move inmultiple planes and along or about multiple axes relative to base 402.

Having discussed the basic structure and function of micro pick up arraymount 202, further details will now be provided with respect toadditional components that micro pick up array mount 202 may be matedto, assembled with, or otherwise combined to form a micro devicetransfer system. For example, micro pick up array mount 202 may bejoined with a micro pick up array. Referring now to FIG. 7, a side viewillustration of a micro pick up array having a substrate supporting anarray of electrostatic transfer heads is shown in accordance with anembodiment of the invention. Micro pick up array 700 may include a basesubstrate 702, formed from one or more of silicon, ceramics, andpolymers, supporting an array of electrostatic transfer heads 703. Eachelectrostatic transfer head 703 may include a mesa structure 704including a top surface 708, which may support an electrode 712.However, electrode 712 is illustrative, and in another embodiment, mesastructure 704 can be wholly or partially conductive, such that electrode712 is not necessary. A dielectric layer 716 covers a top surface ofeach mesa structure and electrode 712 if present. The top contactsurface 718 of each electrostatic transfer head has a maximum dimension,for example a length or width of 1 to 100 μm, which may correspond tothe size of a micro device to be picked up.

Mesa structure 704 protrudes away from base substrate 702 so as toprovide a localized contact point of the top contact surface 718 to pickup a specific micro device during a pick up operation. In an embodiment,mesa structure 704 has a height of approximately 1 μm to 5 μm, or morespecifically approximately 2 μm. In an embodiment, mesa structure 704may have top surface 708 with surface area between 1 to 10,000 squaremicrometers. Mesa structure 704 may be formed in a variety ofgeometries, e.g., square, rectangular, circular, oval, etc., whilemaintaining this general surface area range. The height, width, andplanarity of the array of mesa structures 704 on base substrate 702 arechosen so that each electrostatic transfer head 703 can make contactwith a corresponding micro device during a pick up operation, and sothat an electrostatic transfer head 703 does not inadvertently makecontact with a micro device adjacent to an intended corresponding microdevice during the pick up operation.

Still referring to FIG. 7, electrode lead 714 may place electrode 712 ormesa structure 704 in electrical connection with a terminal of via 720and with substrate electrostatic voltage source contact 722. Substrateelectrostatic voltage source contact 722 of the micro pick up array 700is formed to align with the electrostatic voltage source contacts 420 onthe micro pick up array mount 202 to transfer the operating voltage tothe array of electrostatic transfer heads 703 when operably connectedwith the micro pick up array mount 202, as described in more detail withregard to FIGS. 8-9 below. Electrode lead 714, via 720, and substrateelectrostatic voltage source contact 722 may be formed using methodssimilar to those described above for other leads, vias, contacts, andconnections.

In addition to operating in accordance with electrostatic principles topick up micro devices, the micro pick up array 700 may further beconstructed to be secured or clamped to the micro pick up array mount202 with electrostatic principles. As shown in the embodimentillustrated in FIG. 7, one or more clamp areas 724 may be formed on thebackside of the micro pick up array 700 to align with the clampelectrodes 430 of the micro pick up array mount 202. In accordance withthe principles of electrostatic grippers, using the attraction ofopposite charges, a dielectric layer may be formed over the clampelectrodes 430 in the micro pick up array mount 202 and/or the clampareas 724 on the micro pick up array 700. Clamp areas 724 can be formedby a variety of methods and assume a variety of configurations. In oneembodiment, clamp areas 724 are conductive pads, such as a metal orsemiconductor film, formed on the back surface of the micro pick uparray 700. The conductive pads may be electrically isolated from theother active regions of the micro pick up array 700. For example,insulating layers may be formed under, over, and around the conductivepads. In another embodiment, the clamp areas 724 may be integrallyformed with the micro pick up array, for example bulk silicon, andelectrically isolated from the other active regions of the micro pick uparray 700.

Referring to FIG. 8A, a side view illustration of a micro devicetransfer system including a micro pick up array mount electrostaticallybonded with a micro pick up array is shown in accordance with anembodiment of the invention. Micro pick up array system 800 includesmicro pick up array mount 202 and micro pick up array 700, which isjoinable with micro pick up array mount 202. More specifically, micropick up array 700 may be both physically and electrically joined withmicro pick up array mount 202, as described below.

Micro pick up array 700 may be physically joined with micro pick uparray mount 202 through a temporary bond. For example, clamp electrode430 may be positioned adjacent to clamp areas 724 of substrate 702. Uponapplying an electrostatic voltage through the clamping voltage path frombase clamp contacts 442 to clamp electrodes 430, an electrostaticgripping pressure will be applied to substrate 702, causing micro pickup array 700 to physically bond to micro pick up array mount 202. Thisbond is reversible, in that discontinuation of the electrostatic voltageapplied to clamp electrode 430 may remove the bond and release micropick up array 700 from micro pick up array mount 202. Thus, micro pickup array 700 will be temporarily adjoined to micro pick up array mount202 to form micro device transfer system 800. As described above, inaccordance with the principles of electrostatic grippers, using theattraction of opposite charges, a dielectric layer is formed over theclamp electrodes 430 in the micro pick up array mount 202 and/or theclamp areas 724 on the micro pick up array 700.

Micro pick up array mount 202 may also be operably joined with micropick up array 700. More particularly, substrate electrostatic voltagesource contact 722 of micro pick up array 700 may be aligned with, andplaced adjacent to, pivot platform electrostatic voltage source contact420. In this way, a voltage applied to base electrostatic voltage sourceconnection 433 is transferred through the micro pick up array mount 202to pivot platform electrostatic voltage source contact 420, which iselectrically connected to substrate electrostatic voltage source contact722, and to the array of electrostatic transfer heads 703. Thus, micropick up array mount 202 and micro pick up array 700 may be electricallyconnected to enable an electrostatic voltage to be applied through theoperating voltage path from base electrostatic voltage source connection433 to the array of transfer heads 703 in order to generate anelectrostatic gripping force on an array of micro devices.

Heat can be delivered from micro pick up array mount 202 to micro pickup array 700 and/or to an array of micro devices gripped by micro pickup array 700 when those components are joined to form micro devicetransfer system 800. As shown in FIG. 8A, in an embodiment, heatingcontacts 480 on micro pick up array mount 202 can relay electricalcurrent through heating leads 482 to heating element 484 (shown in FIG.8B) on pivot platform 404. In this manner, heating element 484 can beresistively heated. Thus, heat from heating element 484 on the bottomsurface of micro pick up array mount 202 may transfer through pivotplatform 404 to micro pick up array 700. Furthermore, the heat deliveredto micro pick up array 700 may dissipate through electrostatic transferheads 210 into an array of micro devices gripped by electrostatictransfer heads 210.

Referring to FIG. 8B, a side view illustration of a micro devicetransfer system including a micro pick up array mount electrostaticallybonded with a micro pick up array is shown in accordance with anembodiment of the invention. Micro pick up array 700 may includesubstrate electrostatic voltage source contact 722 and clamp areas 724placed in electrical communication with electrostatic voltage sourcecontacts 420 and clamp electrodes 430, respectively. As discussed aboveelectrostatic voltage source contacts 420 and clamp electrodes 430 maybe interconnected with base electrostatic voltage source contact 433 andbase clamp contact 442, respectively. Furthermore, ribbon cable 460 cansupply voltage to base electrostatic voltage source contact 433 and baseclamp contact 442 from an external component, such as electrostaticvoltage sources of a transfer head assembly 206. Thus, a completeelectrical pathway is formed between the electrostatic voltage sourcesand the substrate.

In an alternative embodiment, ribbon cables 462 can electrically connectwith one or more contacts on the bottom surface of micro pick up arraymount 202. For example, ribbon cable 462 may supply electrical currentto heating contacts 480, and the electrical current can be relayedthrough heating leads 482 to raise the temperature of heating element484. In this manner, heat can be transferred from heating element 484through pivot platform 404 to micro pick up array 700.

In an alternative embodiment, an electrical lead of ribbon cables 462may be connected with base electrostatic voltage source contact 433 orbase clamp contact 442 when they are located on a bottom surface ofmicro pick up array mount 202, such as their position in FIG. 8A. Inthis case, an operating voltage and clamping voltage delivered throughribbon cables 462 may then be transferred to electrostatic voltagesource contacts 420 and clamp electrodes 430 on a top surface of micropick up array mount 202 through vias and traces.

Referring to FIG. 9A, a side view illustration of a micro devicetransfer system including a micro pick up array mount permanently bondedwith a micro pick up array is shown in accordance with an embodiment ofthe invention. Micro pick up array 700 may be permanently bonded tomicro pick up array mount 202 to form micro device transfer system 900.Micro pick up array mount 202 may include bonding pad 500. Bonding pad500 may be formed of a variety of materials including polymers, solders,metals, and other adhesives. To further facilitate bonding, a bondingpad 502 may be formed on substrate 702 in addition to, or alternative tobonding pad 500. In an embodiment, bonding pads 500 and/or 502 areformed of a metallic material and the substrates micro pick up arraymount 202 and micro pick up array 700 are bonded together with athermocompression bond. Thus, in at least one embodiment, micro pick uparray 700 may be permanently adjoined to micro pick up array mount 202to form micro device transfer system 900. Prior to permanently bondingmicro pick up array mount 202 and micro pick up array 700, theelectrical contacts of those components may be aligned to ensure thatthe bonded components remain in electrical connection with one another.More particularly, alignment of pivot platform electrostatic voltagesource contact 420 and substrate electrostatic voltage source contact722 are aligned.

Heat can be delivered from micro pick up array mount 202 to micro pickup array 700 and/or to an array of micro devices gripped by micro pickup array 700 when those components are joined to form micro devicetransfer system 900. As shown in FIG. 9A, in an embodiment, heatingcontacts 480 on micro pick up array mount 202 can relay electricalcurrent through heating leads 482 to heating element 484. Heatingelement 484 can be resistively heated by the current, and heat maytherefore transfer from heating element 484 on the bottom surface ofmicro pick up array mount 202 through pivot platform 404 to micro pickup array 700.

In an alternative embodiment, an electrical lead of ribbon cables 462may be connected with base electrostatic voltage source contact 433 whenit is located on a bottom surface of micro pick up array mount 202, suchas its position in FIG. 9A. In this case, an operating voltage deliveredthrough ribbon cables 462 may then be transferred to electrostaticvoltage source contacts 420 on a top surface of micro pick up arraymount 202 through vias and traces.

Referring to FIG. 9B, a side view illustration of a micro devicetransfer system including a micro pick up array mount permanently bondedwith a micro pick up array is shown in accordance with an embodiment ofthe invention. Ribbon cables 460 can be placed in electricalcommunication with base electrostatic voltage source contact 433 tosupply voltage from an external component, such as an electrostaticvoltage source of the transfer head assembly 206, through the varioustraces, contacts, and connections of micro pick up array mount 202 andmicro pick up array 700, into electrostatic transfer heads 703.

In an embodiment, ribbon cable 462 can supply electrical current toheating contacts 480, and the electrical current can be relayed throughheating leads 482 to raise the temperature of heating element 484. Thus,heat can be transferred from heating element 484 through pivot platform404 to micro pick up array 700.

Referring to FIG. 10A, a cross-sectional side view illustration showinga portion of a micro device transfer system including a transfer headassembly holding a micro pick up array mount with a micro pick up arraymounted on the micro pick up array mount is shown in accordance with anembodiment of the invention. As described above, micro pick up array 700may be attached to micro pick up array mount 202 through either atemporary or a permanent bond. Similarly, micro pick up array mount 202may be joined with transfer head assembly 206 in numerous ways. Forexample, an attachment may be formed pneumatically, electrostatically,or mechanically.

In an embodiment, micro pick up array mount 202 may be placed againstmounting surface 208 of a transfer head assembly, and a holdingmechanism of transfer head assembly 206 may be activated to retain micropick up array mount 202. For example, in at least one embodiment themicro pick up array mount 202 may be releasably attached and detachedfrom the mounting surface 208 by applying a suction through vacuum port1002 in mounting surface 208. Vacuum port 1002 may be coupled withvacuum source 1004 for drawing suction on an object placed againstmounting surface 208. More particularly, when micro pick up array mount202, is positioned against mounting surface 208, suction may be drawnthrough vacuum port 1002 to create a negative pressure within one ormore vacuum channels 1006. Thus, micro pick up array mount 202 may bepushed against the mounting surface 208 by the pressure differencebetween vacuum channel 1006 and the surrounding atmosphere. As a result,micro pick up array mount 202 attaches to mounting surface 208. When thevacuum source is disconnected or the negative pressure in the vacuumchannel 1006 is insufficient to retain micro pick up array mount 202,the attachment is discontinued and the micro pick up array mount 202 maybe released and removed.

In an alternative embodiment, micro pick up array mount 202 may beretained against mounting surface 208 by an electrostatic force. In suchan embodiment, rather than applying suction to micro pick up array mount202 through vacuum port 1002, clamping electrode 1010 and lead 1007 mayreplace vacuum port 1002 and vacuum channel 1006. Electrostatic voltagemay be applied to clamping electrode 1010 from an electrostatic voltagesource 1012, which replaces the vacuum source 1004. In such anembodiment, micro pick up array mount 202 may include a clamp area 450.

Thus, when the clamp areas 450 are placed adjacent the clampingelectrodes 1010, an electrostatic force may be applied to retain themicro pick up array mount 202 against the mounting surface 208.

Numerous other manners of retaining micro pick up array mount 202 may beused so that the use of vacuum or electrostatic clamping components isnot required. For example, in yet another embodiment, one or moremechanical fasteners may be used to retain micro pick up array mount 202against mounting surface 208. As an example, screws can be placed inthrough holes formed in base 402 and threaded into counter bored holesin mounting surface 208 such that a head of the screw, e.g., of a capscrew, will retain the base 402 against the mounting surface 208.Alternatively, clips can be used, such as spring loaded clips, to fastenthe base against the mounting surface 208. In this case, the clips canapply a fastening load to base 402 on the same side as of micro pick uparray mount 202 that receives a micro pick up array 700. Othermechanical retaining features such as pins may be used to retain micropick up array mount 202 against mounting surface 208. Additionally,alternative bonding mechanisms, such as adhesives can be used to retainthe micro pick up array mount 202. For example, an appropriate adhesivecan be used to form a bond between mounting surface 208 and base 402,depending on the materials used to form transfer head assembly 206 andmicro pick up array mount 202.

Transfer head assembly 206 may include electrical interconnects forsupplying a clamping voltage to micro pick up array mount 202 forholding the micro pick up array 700. For example, as described above,micro pick up array mount 202 may include clamp electrode 430 forapplying a gripping pressure to micro pick up array 700. In order toinduce this gripping pressure, transfer head assembly 206 may supply anelectrostatic voltage to base clamp contact 442. More particularly,clamping voltage source connection 1040 of transfer head assembly 206may supply voltage delivered from an electrostatic voltage source 1042connected to clamping voltage source connection 1040 by wires or otherelectrical connections. As discussed above, the electrostatic voltagedelivered to clamp electrode 430 permits micro pick up array mount 202to physically join with micro pick up array 700.

In another embodiment, micro pick up array 700 may alternatively beretained against micro pick up array mount 700 using vacuum. Forexample, in an embodiment, vacuum channels may run through transfer headassembly 206 and micro pick up array mount 202, terminating in a vacuumport that apposes the back surface of micro pick up array 700. Thevacuum channels may form a singular conduit as a result of being alignedand sealed at the interfaces of the various components, using sealingcomponents that are known in the art. Furthermore, channels may runthrough the wall of micro pick up array 700, e.g., extending from base402, through the lengths of beams 406, and into pivot platform 404,eventually terminating at a mounting surface 205 of pivot platform 404.In such an embodiment, the vacuum channels may be connected to a vacuumsource (not shown) to create a suction that retains micro pick up array700 against micro pick up array mount 202.

Transfer head assembly 206 may also include electrical interconnects forsupplying an operating voltage to the micro pick up array 700. Asdescribed above, an electrostatic voltage may be the electrostatictransfer heads 703 of micro pick up array 700 to apply a grippingpressure to adjacent micro devices. In order to induce this grippingpressure, transfer head assembly 206 may supply an electrostatic voltageto substrate electrostatic voltage source contact 722 through micro pickup array mount 202. More particularly, electrostatic voltage sourceconnection 1060 may supply electrostatic voltage to base electrostaticvoltage source contact 433 from an electrostatic voltage source 1062connected with electrostatic voltage source connection 1060 by variouswires or other electrical interconnects. As discussed above, theelectrostatic voltage delivered to base electrostatic voltage sourcecontact 433 may propagate through various vias, traces, and connectionsin the operating voltage path to the electrostatic transfer heads 703.

Transfer head assembly 206 may further include electrical interconnectsfor supplying a heating current to micro pick up array mount 202. Asdescribed above, an electrical current may be introduced to heatingcontacts 480 to raise the temperature of heating element 484. Heatingcontacts 480 of micro pick up array mount 202 may be placed inelectrical connection with heating connection 1090 of transfer headassembly 206 to receive the electrical current. More particularly,heating connection 1090 can transfer electrical current supplied byheating current source 1094 through heating connection leads 1092. Asdiscussed above, running electrical current through heating element 484causes the element to generate heat that may transfer to micro pick uparray 700 mounted on micro pick up array mount 202. More particularly,heat may be transferred from heating element 484 to micro devices placedin contact with array of electrostatic transfer heads 703 on micro pickup array 700.

Transfer head assembly 206 may further include recessed surface 1020,which is generally configured to align with and receive pivot platform404 and beams 406 when pivot platform 404 is deflected relative to base402. For example, recessed surface 1020 and sidewall profile 1104 areformed within the mounting surface 208 of the transfer head assembly 206to form a cavity. Thus, pivot platform 404 may float over the cavity inthe mounting surface 208, which retains base 402, for example, rigidly,using one or more of the retention techniques described above.

Micro device transfer system 200 may also include a sensor 1030 todetect deflection of the micro pick up array mount 202. In anembodiment, sensor 1030 is fixed relative to transfer head assembly 206.More particularly, sensor 1030 may include a threaded body that isscrewed into a sensor channel 1032 extending from recessed surface 1020.Furthermore, sensor 1030 may include probe 1034, configured to extendbeyond recessed surface 1020 in the direction of pivot platform 404.Accordingly, when pivot platform 404 of micro pick up array mount 202 isundeflected, probe 1034 of sensor 1030 will remain in an extended state.Sensor 1030 may be a contact sensor and probe 1034 may be aspring-loaded probe of the contact sensor. The contact sensor may act asa switch or a feedback mechanism. For example, sensor 1030 may be aswitch with a normally opened state when probe 1034 is in an extendedposition.

In an embodiment, sensor 1030 may effectively be a contact of an opencircuit. In such a case, the open circuit may close when the contact istouched by pivot platform 404 or another conductive portion of micropick up array mount 202. More specifically, a source may supply voltageto a lead that extends from a positive terminal of the source to sensor1030. Furthermore, a lead may extend from a negative terminal of thesource to a surface of micro pick up array mount 202. The surface may bemetallized, for example, to increase the local conductivity. Thus, whensensor 1030 contacts the surface of micro pick up array mount 202, thecircuit may close and current flows through the circuit. This currentmay be sensed by an external sensor, e.g., by a current sensor, thatthen delivers a signal to computer system 150 indicating whether themicro pick up array mount 700 has deflected into contact with sensor1030.

A contact sensor is only one example of a sensor that may be used todetect deflection of the micro pick up array mount 202. For example,non-contact sensors, including laser interferometers capable of sensingabsolute position of a remote object, may be used to detect when thepivot platform 404 has deflected from an original position and/or comeinto contact with recessed surface 1020. In other embodiments sensor1030 may include proximity sensors, optical sensors, and ultrasonicsensors.

One or more of these sensors may determine movement of pivot platform404 without acting as a hard stop that prevents additional movement ofpivot platform 404 as it deflects. In other words, sensor 1030, whetherof a contact or non-contact type, may detect movement of pivot platform404 without impeding the deflection of pivot platform 404.

Sensor 1030 may provide input and feedback to computer system 150 thatcontrols various actuators of mass transfer tool 100. For example,sensor 1030 may be connected with I/O ports of computer system 150 todeliver signals related to the sensor 1030 being in an open or closedstate. Based on the sensor 1030 state, computer system 150 may determinewhether a specific condition is met, e.g., whether micro pick up arraymount 202 is in a deflected condition, and thus, may provide controlsignals to actuators or intermediate motion controllers to regulate themovement of mass transfer tool 100.

Referring to FIG. 10B, a cross-sectional side view illustration showinga portion of a micro device transfer system including a transfer headassembly holding a micro pick up array mount with a micro pick up arraymounted on the micro pick up array mount is shown in accordance with anembodiment of the invention. Micro pick up array mount 202 illustratedin FIG. 10B may be retained against the mounting surface 208 of thetransfer head assembly in any of the manners described above with regardto FIG. 10A, such as mechanical fastening, adhesive, vacuum,electrostatic, etc. The electrical interconnects and supply routes oftransfer head assembly 206 illustrated in FIG. 10B can be varied toincorporate ribbon cables. More particularly, ribbon cables 460 caninclude an electrical wire interconnecting base electrostatic voltagesource contact 433 with electrostatic voltage source connection 1060, aswell as an electrical wire interconnecting base clamp contact 442 withclamping voltage source connection 1040. Thus, voltage can be suppliedto base electrostatic voltage source contact 433 and base clamp contact442 from electrostatic voltage sources 1062 and 1042, respectively.Furthermore, ribbon cables 462 can include an electrical wireinterconnecting heating contact 480 with heating connection 1090. Thus,electrical current can be supplied to heating contact 480 from heatingcurrent source 1094. Ribbon cables 460 and 462 can also be used tocommunicate electrical signals for a variety of purposes betweentransfer head assembly 206 and micro pick up array mount 202. Forexample, ribbon cables 460 and 462 can be used to transfer electricalsignals from sensors, such as temperature sensor 440, placed on asurface of micro pick up array mount 202 or micro pick up array 700.Therefore, in an embodiment, micro pick up array mount 202 does notinclude vias to transfer voltage or current from transfer head assembly206 to micro pick up array 700.

Referring to FIG. 11, a perspective view illustration of a transfer headassembly having multiple sensors to detect deflection of a micro pick uparray mount is shown in accordance with an embodiment of the invention.Several sensors 1030 may be located at various locations on transferhead assembly 206. For example, sensors 1030 a-1030 d may be located ineach corner of the recessed portion of mounting surface 208, i.e., ineach corner of recessed surface 1020. Multiple sensors 1030 providesmore response to deflection of micro pick up array mount 202 in thateach sensor 1030 may sense deflection of a different area of micro pickup array mount 202. For example, sensor 1030 a in one corner of recessedsurface 1020 may sense deflection of one corner of pivot platform 404while sensor 1030 in another corner of recessed surface 1020 may sensedeflection of another corner of pivot platform 404. In this way, unevendeflection of pivot platform 404 relative to base 402 may be detected.

As mentioned above, pivot platform 404 may have a profile that issmaller than recessed portion profile 1104 to ensure that pivot platform404 is able to deflect. Likewise, base profile 1202 of base 402,indicated by a dotted line, may have a larger profile than recessedportion profile 1104 and therefore may remain rigidly fixed relative tomounting surface 208 even when a deflecting force is applied to pivotplatform 404. That is, base 402 may be apposed by mounting surface 208to resist base 402 movement and facilitate relative movement betweenbase 402 and deflected pivot platform 404. Nonetheless, in at least oneembodiment, a portion of base 402 could be smaller than recessed portionprofile 1104 while still allowing pivot platform 404 to move relative tobase 402.

Referring to FIG. 12, a cross-sectional side view illustration showing aportion of a micro device transfer system including a transfer headassembly holding a micro pick up array mount with a micro pick up arraymounted on the micro pick up array mount and the transfer head assemblyhaving multiple sensors to detect deflection of the micro pick up arrayis shown in accordance with an embodiment of the invention. Further tothe description provided above, base 402 may include an inner edge 1202having a profile that is larger than, or equal to, recessed portionprofile 1104, indicated here by a wall of the recessed portion. Also,pivot platform 404 includes an outer edge 1204 having a profile that issmaller than recessed portion profile 1104. Likewise, beam 406 mayinclude an outer edge 1206 having a profile that is smaller thanrecessed portion profile 1104.

Sensor 1210 and sensor 1212 are shown aligned with opposite corners ofpivot platform 404. Thus, sensors 1210 and 1212 will individually sensedeflection of pivot platform 404, and provide feedback related to pivotplatform 404 position. More particularly, if a corner of pivot platform404 adjacent to outer edge 1204 deflects, it will trigger sensor 1212,which may either trigger a signal as an input to computer system 150, ormay act as a switch that directly controls a motor or other actuatorthat controls motion of the micro device transfer system relative to acarrier substrate or receiving substrate. Similarly, if a corner ofpivot platform 404 adjacent to outer edge 1204 deflects, it will triggersensor 1210 control motion.

Referring to FIG. 13, a cross-sectional side view illustration showing aportion of a micro device transfer system including a transfer headassembly holding a micro pick up array mount with a micro pick up arraymounted on the micro pick up array mount and the micro pick up arraymount deflected toward sensors on the transfer head assembly is shown inaccordance with an embodiment of the invention. This embodimentillustrates a scenario in which pivot platform 404 is in a deflectedstate. Such deflection may occur, for example, when the array ofelectrostatic transfer heads 703 of micro pick up array 700 come intocontact with an array of micro devices, a carrier substrate, a receivingsubstrate, or another external object. Pressure placed on the array ofelectrostatic transfer heads 703 causes deflection of pivot platform 404and beam 406. As a result, those components may move into the recessedprofile 1104 of mounting surface 208, eventually contacting andtriggering sensors 1210 and 1212. Although pivot platform 404 is shownas being flush with recessed surface 1020, pivot platform 404 could betilted. For example, array of electrostatic transfer heads 703 couldcontact a carrier substrate plane that is not parallel to recessedsurface 1020, and thus, as pivot platform 404 deflects into recessedportion 1020, it may tilt and trigger only one of the sensors, ordepress one sensor more than another. Sensors 1210 and 1212 may beconfigured to sense such uneven deflection of pivot platform 404 and toprovide feedback to control motion of the mass transfer tool 100accordingly.

Referring to FIG. 14, a flowchart illustrating a method of picking up anarray of micro devices from a carrier substrate is shown in accordancewith an embodiment of the invention. For illustrational purposes, thefollowing description of FIG. 14 is also made with reference to theembodiments illustrated in FIGS. 15A-15D. At operation 1401, transferhead assembly 206 is moved toward carrier substrate 302. Referring toFIG. 15A, a cross-sectional side view illustration of a micro devicetransfer system having a transfer head assembly moving toward a carriersubstrate is shown in accordance with an embodiment of the invention.The micro pick up array 700 may be mounted on micro pick up array mount202, which is held against transfer head assembly 206. As shown, pivotplatform 404 may be undeflected, with a gap between an upper surface ofpivot platform 404 and one or more sensors 1212. Furthermore, the microdevice transfer system is shown prior to contact being made between thearray of electrostatic transfer heads 703 and the array of micro devices1501 carried on the carrier substrate 302, and thus, there is a gapbetween those components. In this state, transfer head assembly 206 maybe connected with various actuators of mass transfer tool 100, whichmove transfer head assembly 206 toward carrier substrate 302 under thedirect or indirect control of computer system 150.

Referring again to FIG. 14, at operation 1405, electrostatic transferheads 703 carried on micro pick up array 700 contact an array of microdevices 1501 on carrier substrate 302. Referring to FIG. 15B, across-sectional side view illustration of a micro device transfer systemhaving an array of electrostatic transfer heads contacting an array ofmicro devices on a carrier substrate is shown in accordance with anembodiment of the invention. As an example, mass transfer tool 100actuators have moved transfer head assembly 206 toward carrier substrate302 until the gap between the array of micro devices 1501 andelectrostatic transfer heads 703 has closed. However, pivot platform 404remains undeflected, and therefore, the gap between sensor 1212 and theupper surface 405 of pivot platform 404 remains unchanged from the stateshown in FIG. 15A. Although shown in alignment, at this point one ormore electrostatic transfer heads 703 may not be in contact with thearray of micro devices 1501.

Referring again to FIG. 14, at operation 1410, pivot platform 404 ofmicro pick up array mount 202 deflects toward transfer head assembly 206as the transfer head assembly 206 continues to move toward the carriersubstrate. Referring to FIG. 15C, a cross-sectional side viewillustration of a micro device transfer system having a micro pick uparray mount deflecting toward a transfer head assembly is shown inaccordance with an embodiment of the invention. As shown, the uppersurface 405 of pivot platform 404 has contacted and depressed sensor(s)1212. Base 402 has remained in contact with mounting surface 208 oftransfer head assembly 206. However, beam 406 has bent and/or twisted toenable pivot platform 404 to deflect toward sensor(s) 1212.

Referring again to FIG. 14, at operation 1415, the deflection of pivotplatform 404 is sensed. As shown in FIG. 15C, sensor 1212 is contactedand depressed by upper surface of pivot platform 404. The depression ofsensor 1212 may trigger a signal transmission to computer system 150,the signal indicating that pivot platform 404 has deflected. Sensor 1212may detect a single location on pivot platform 404. Thus, in anembodiment, sensor 1212 indicates whether pivot platform 404 hasdeflected, but may not indicate whether the deflection is uniform acrossthe entire pivot platform 404. However, in an alternative embodiment,several sensors 1212 may be used, and thus, additional informationregarding the orientation of pivot platform 404 may be evaluated andsupplied to computer system 150 to further control movement of masstransfer tool 100 and the micro device transfer system.

At operation 1420, relative movement between transfer head assembly 206and carrier substrate 302 may be stopped. In an embodiment, as shown inFIG. 15C, pivot platform 404 has deflected with an upper surface 405nearly parallel to recessed surface 1020. However, in other embodiments,pivot platform 404 may be tilted relative to recessed surface 1020.Relative movement between transfer head assembly 206 and carriersubstrate 302 may be stopped immediately upon detecting deflection ofpivot platform 404, or movement of transfer head assembly 206 can becontinued after and detection prior to stopping the relative movement.For example, computer system 150 can control actuators of mass transfertool 100 to cause movement of transfer head assembly 206 for apredetermined time or distance after detecting deflection. Thisadditional range of motion following detection may ensure that completecontact is made between all, or almost all, of the electrostatictransfer heads and micro devices. Thus, detection of deflection can bean input in a chain of inputs that lead to halting movement of thetransfer head assembly 206.

In accordance with embodiments of the invention, information obtainedfrom the sensor(s) 1212 can be used to operate the mass transfer tool100 in a variety of fashions. In one embodiment, the tool may beoperated in a drive to contact fashion in which the relative movementbetween the transfer head assembly 206 and carrier substrate stops onlywhen all sensors have detected deflection. In another embodiment,relative movement is continued a set distance after a specific number ofsensors have detected deflection. By way of example, once a first sensoror all of the sensors have detected deflection, the relative movementmay be continued for a set distance such as 10 nm to 1 μm. The setdistance may vary based upon size of the micro devices, size of theelectrostatic transfer heads, as well as the size and elastic modulus ofthe micro pick up array mount 202. In another embodiment, relativemovement is stopped as soon as deflection is detected by any sensor. Inyet another embodiment, upon detection of deflection of only a subset ofthe sensors, the transfer head assembly 206 may be actuated to furtheralign the pivot platform 404 with the carrier substrate plane by tippingor tilting the transfer head assembly 206.

Still referring to FIG. 15C, the movement of transfer head assembly 206may be stopped in a state where each electrostatic transfer head 703 isin contact with an apposing micro device 1501. In some embodiments orinstances, this may not occur. However, in at least one embodiment, thedeflection of pivot platform 404 facilitates this uniform contact toallow transferring an array of micro devices 1501 completely withoutdamaging electrostatic transfer heads 703 or micro devices 1501.

Referring again to FIG. 14, at operation 1425, a voltage may be appliedto the array of electrostatic transfer heads 703 to create a grippressure on the corresponding array of micro devices 1501 on carriersubstrate 302. As shown in FIG. 15C, with electrostatic transfer heads703 placed in contact with micro devices 1501, an electrostatic voltagemay be applied to electrostatic transfer heads 703 through variouscontacts and connectors, e.g., vias and traces, of the micro pick uparray mount 202 and micro pick up array 700. More specifically, voltagemay be transmitted from electrostatic voltage source 1062, through theelectrostatic voltage source connection 1060 of transfer head assembly206, through base electrostatic voltage source connection 433 and pivotplatform electrostatic voltage source contact 420 into substrateelectrostatic voltage source contact 722 before reaching electrostatictransfer heads 703. As a result, a gripping pressure is applied to thearray of micro devices 1501 from the array of electrostatic transferheads 703.

Referring again to FIG. 14, at operation 1430, the array of microdevices on carrier substrate 302 is picked up from carrier substrate302. Referring to FIG. 15D, a cross-sectional side view illustration ofa micro device transfer system having an array of electrostatic transferheads picking up an array of micro devices from a carrier substrate isshown in accordance with an embodiment of the invention. Actuators ofmass transfer 100 may be controlled by computer system 150 to causetransfer head assembly 206 to retract from carrier substrate 302. Duringretraction, pivot platform 404 may return toward an undeflected state,as beams 406 release stored energy and spring back to an initialconfiguration. Simultaneously, sensor 1212 may extend past recessedsurface 1020 to an initial configuration. During pick up, theelectrostatic voltage supplied to electrostatic transfer heads 703persists, and thus, micro devices 1501 are retained on electrostatictransfer heads 703 and removed from carrier substrate 302, once transferhead assembly 206 is sufficiently retracted.

During the pick up process described with respect to FIG. 14, heatingelement 484 on micro pick up array mount 202 may be heated. For example,heating element 484 can be resistively heated to transfer heat to micropick up array 700 and to micro devices in contact with electrostatictransfer heads 210. Heat transfer can occur before, during, and afterpicking up the array of micro devices from carrier substrate 302.

Following pick up of micro devices 1501 from carrier substrate 302, masstransfer tool 100 may be controlled by computer system 150 to move microdevices 1501 toward a receiving substrate in order to complete thetransfer of the micro devices. For example, actuators and sensors ofmass transfer tool 100 may be used to position transfer head assembly206 over a receiving substrate held by a receiving substrate holder 124.After re-positioning the transfer head assembly 206 to prepare fortransferring, the following process may be performed.

Referring to FIG. 16, a flowchart illustrating a method of releasing anarray of micro devices onto a receiving substrate is shown in accordancewith an embodiment of the invention. For illustrational purposes, thefollowing description of FIG. 16 is also made with reference to theembodiments illustrated in FIGS. 17A-17C. At operation 1601, transferhead assembly 206 is moved toward a receiving substrate on receivingsubstrate holder 124. Referring to FIG. 17A, a cross-sectional side viewillustration of a micro device transfer system having a transfer headassembly moving toward a receiving substrate is shown in accordance withan embodiment of the invention. Pivot platform 404 may be undeflected,with a gap between an upper surface 405 of pivot platform 404 and one ormore sensors 1212. The micro pick up array 700 may be mounted on micropick up array mount 202, which is retained against transfer headassembly 206 in one of the manners described above. Furthermore, arrayof electrostatic transfer heads 703 grips array of micro devices 1501,however, a gap exists between array of micro devices 1501 and receivingsubstrate 1702. In this state, transfer head assembly 206 may be movedtoward receiving substrate 1702 by mass transfer tool 100 under thecontrol of computer system 150.

Referring again to FIG. 16, at operation 1605, the array of microdevices carried by electrostatic transfer heads 703 contacts thereceiving substrate. The micro pick up array 700 may be mounted on micropick up array mount 202, which may be held against transfer headassembly 206 in one of the manners described above. Referring to FIG.17B, a cross-sectional side view illustration of a micro device transfersystem having an array of electrostatic transfer heads carrying an arrayof micro devices contacting a receiving substrate is shown in accordancewith an embodiment of the invention. Transfer head assembly 206 hasmoved toward receiving substrate 1702 until the gap between the array ofmicro devices 1501 and receiving substrate 1702 has closed. However,pivot platform 404 remains undeflected, and therefore, the gap betweensensor 1212 and the upper surface of pivot platform 404 remainsunchanged from the state shown in FIG. 17A. Although shown in alignment,at this point one or more micro devices 1501 may not be in contact withreceiving substrate 1702.

Referring again to FIG. 16, at operation 1610, pivot platform 404 ofmicro pick up array mount 202 deflects toward transfer head assembly 206as the transfer head assembly 206 continues to move toward the carriersubstrate. Referring to FIG. 17C, a cross-sectional side viewillustration of a micro device transfer system having a micro pick uparray mount deflecting toward a transfer head assembly is shown inaccordance with an embodiment of the invention. As shown, the uppersurface 405 of pivot platform 404 has contacted and depressed sensor(s)1212. Base 402 has remained in contact with mounting surface 208 oftransfer head assembly 206. However, beam 406 has bent or twisted todeflect away from receiving substrate 1702 such that pivot platform 404deflects toward sensor(s) 1212.

Referring again to FIG. 16, at operation 1615, the deflection of pivotplatform 404 may be sensed. As shown in FIG. 17C, sensor 1212 iscontacted and depressed by upper surface of pivot platform 404. Thedepression of sensor 1212 may trigger a signal transmission to computersystem 150, the signal indicating that pivot platform 404 has deflected.Sensor 1212 may detect a single location on pivot platform 404. Thus, inan embodiment, sensor 1212 indicates whether pivot platform 404 hasdeflected, but may not indicate whether the deflection is uniform acrossthe entire pivot platform 404. However, in an alternative embodiment,several sensors 1212 may be used, and thus, additional informationregarding the orientation of pivot platform 404 may be evaluated andsupplied to computer system 150 to control movement of mass transfertool 100 and the micro device transfer system.

In an embodiment, such as the one shown in FIG. 17C, pivot platform 404has deflected with an upper surface 405 nearly parallel to recessedsurface 1020. However, in other embodiments, pivot platform 404 may betilted relative to recessed surface 1020. Relative movement betweentransfer head assembly 206 and carrier substrate 302 may be stopped atoperation 1620 in a variety of embodiments. For example, relativemovement may be stopped immediately upon detecting deflection of pivotplatform 404, or movement of transfer head assembly 206 can be continuedafter detection. Computer system 150 can control mass transfer tool 100to move transfer head assembly 206 for a predetermined time or distanceafter detecting deflection. This additional range of motion followingdetection may ensure that complete contact is made between all, oralmost all, of the micro devices and the receiving substrate. Thus,detection of deflection can be an input in a chain of inputs that leadto halting movement of the transfer head assembly 206.

In accordance with embodiments of the invention, information obtainedfrom the sensor(s) 1212 can be used to operate the mass transfer tool100 in a variety of fashions. In one embodiment, the tool may beoperated in a drive to contact fashion in which the relative movementbetween the transfer head assembly 206 and receiving substrate stopsonly when all sensors have been detected deflection. In anotherembodiment, relative movement is continued a set distance after aspecific number of sensors have detected deflection. By way of example,once a first sensor or all of the sensors have detected deflection, therelative movement may be continued for a set distance such as 10 nm to 1μm. The set distance may vary based upon size of the micro devices,electrostatic transfer heads, as well as the size and elastic modulus ofthe micro pick up array mount 202. In another embodiment, relativemovement is stopped as soon as deflection is detected by any sensor. Inyet another embodiment, upon detection of deflection of only a subset ofthe sensors, the transfer head assembly 206 may be actuated to furtheralign the pivot platform 404 with the receiving substrate plane bytipping or tilting the transfer head assembly 206 or receivingsubstrate.

Referring again to FIG. 16, at operation 1625, heat may be applied tothe array of micro devices. For example, heating element 484 may beresistively heated as described above to transfer heat through micropick up array mount 202 into the array of electrostatic transfer heads703 that appose micro devices 1501. Micro devices 1501 may be heatedthroughout the placement process described with respect to FIG. 16.Maintaining an elevated temperature of micro pick up array mount 202 inthis manner can avoid some problems that arise from temperaturevariations in an operating environment. However, more particularly,micro devices 1501 may be heated after deflection of pivot platform 404is sensed and/or after micro devices 1501 are in contact with receivingsubstrate 1702. In an embodiment, each electrostatic transfer head 703in the array is heated uniformly, e.g., to a temperature of 50 degreesCelsius, 180 degrees Celsius, 200 degrees Celsius, or even up to 350degrees Celsius. These temperatures can cause melting or diffusionbetween micro devices 1501 and receiving substrate 1702.

Referring again to FIG. 16, at operation 1630, the voltage may beremoved from the array of electrostatic transfer heads 703. As shown inFIG. 17C, with micro devices 1501 in contact with receiving substrate1702, the electrostatic voltage may be removed from electrostatictransfer heads 703. For example, the electrostatic voltage was appliedto electrostatic transfer heads 703 through various contacts andconnectors, e.g., vias and traces of the micro pick up array mount 202and micro pick up array 700 may be discontinued or removed.

Referring again to FIG. 16, at operation 1635, the array of microdevices may be released onto the receiving substrate. Referring to FIG.17D, a cross-sectional side view illustration of a micro device transfersystem releasing an array of micro devices onto a receiving substratefrom an array of electrostatic transfer heads is shown in accordancewith an embodiment of the invention. After electrostatic voltage isremoved from electrostatic transfer heads 703, the grip pressure betweenelectrostatic transfer heads 703 and micro devices 1501 is attenuated,and thus micro devices 1501 may release onto an adjacent surface ofreceiving substrate 1702. Following release of micro devices 1501, masstransfer tool 100 may be controlled to retract transfer head assembly206 from receiving substrate 1702. During retraction, pivot platform 404may return toward an undeflected state, as beams 406 spring back to aninitial configuration. Simultaneously, sensor 1212 may extend pastrecessed surface 1020 to an initial configuration.

Transfer head assembly 206 may continue to lift away from receivingsubstrate 1702. Thus, a gap will occur between electrostatic transferheads 703 and micro devices 1501, as micro devices 1501 are releasedonto receiving substrate 1702. Subsequently, transfer head assembly 206may be moved back toward carrier substrate 302 to continue the transferprocess by transferring another array of micro devices 1501, asdescribed above.

Referring to FIG. 18, a schematic illustration of an exemplary computersystem that may be used is shown in accordance with an embodiment of theinvention. Portions of embodiments of the invention are comprised of orcontrolled by non-transitory machine-readable and machine-executableinstructions which reside, for example, in machine-usable media of acomputer control system 150. Computer system 150 is exemplary, and thatembodiments of the invention may operate on or within, or be controlledby a number of different computer systems including general purposenetworked computer systems, embedded computer systems, routers,switches, server devices, client devices, various intermediatedevices/nodes, stand-alone computer systems, and the like.

Computer system 150 of FIG. 18 includes an address/data bus 1810 forcommunicating information, and a central processor unit 1801 coupled tobus 1810 for processing information and instructions. System 150 alsoincludes data storage features such as a computer usable volatile memory1802, e.g. random access memory (RAM), coupled to bus 1810 for storinginformation and instructions for central processor unit 1801, computerusable non-volatile memory 1803, e.g. read only memory (ROM), coupled tobus 1810 for storing static information and instructions for the centralprocessor unit 1801, and a data storage device 1804 (e.g., a magnetic oroptical disk and disk drive) coupled to bus 1810 for storing informationand instructions. System 150 of the present embodiment also includes anoptional alphanumeric input device 1806 including alphanumeric andfunction keys coupled to bus 1810 for communicating information andcommand selections to central processor unit 1801. System 150 alsooptionally includes an optional cursor control device 1807 coupled tobus 1810 for communicating user input information and command selectionsto central processor unit 1801. System 150 of the present embodimentalso includes an optional display device 1805 coupled to bus 1810 fordisplaying information.

The data storage device 1804 may include a non-transitorymachine-readable storage medium 1808 on which is stored one or more setsof instructions (e.g. software 1809) embodying any one or more of themethodologies or operations described herein. Software 1809 may alsoreside, completely or at least partially, within the volatile memory1802, non-volatile memory 1803, and/or within processor 1801 duringexecution thereof by the computer system 150, the volatile memory 1802,non-volatile memory 1803, and processor 1801 also constitutingnon-transitory machine-readable storage media.

In the foregoing specification, the invention has been described withreference to specific exemplary embodiments thereof. It will be evidentthat various modifications may be made thereto without departing fromthe broader spirit and scope of the invention as set forth in thefollowing claims. The specification and drawings are, accordingly, to beregarded in an illustrative sense rather than a restrictive sense.

What is claimed is:
 1. A micro pick up array mount comprising: a pivotplatform; a base laterally around the pivot platform, wherein the pivotplatform is movable relative to the base; a beam physically coupled withthe pivot platform at an inner pivot and physically coupled with thebase at an outer pivot; a voltage source contact on the base; anelectrostatic voltage source contact on the pivot platform to transferan operating voltage; a source trace that connects the voltage sourcecontact to the electrostatic voltage source contact; a clamp contact onthe base; a clamping electrode on the pivot platform; and a clamp tracethat connects the clamp contact to the clamping electrode.
 2. The micropick up array mount of claim 1, further comprising a ribbon cablecoupled to the voltage source contact and the clamp contact.
 3. Themicro pick up array mount of claim 1, wherein the outer pivot is on abase edge and the inner pivot is on a pivot platform edge, and the baseedge is orthogonal to the pivot platform edge.
 4. The micro pick uparray mount of claim 3, further comprising second beam coupled with thebase by a second outer pivot on a second base edge and coupled with thepivot platform by a second inner pivot on a second pivot platform edge.5. The micro pick up array mount of claim 3, wherein the beam is coupledwith the pivot platform at a second inner pivot and coupled with thebase at a second outer pivot.
 6. The micro pick up array mount of claim5, wherein the inner pivot is across the pivot platform from the secondinner pivot, and the outer pivot is across the pivot platform from thesecond outer pivot.
 7. The micro pick up array mount of claim 1, whereinthe inner pivot and the outer pivot each comprise silicon.
 8. The micropick up array mount of claim 1, further comprising: a second voltagesource contact on the base; a second electrostatic voltage sourcecontact on the pivot platform to transfer a second operating voltage;and a second source trace that connects the second voltage sourcecontact to the second electrostatic voltage source contact.
 9. The micropick up array mount of claim 1, further comprising: a second clampcontact on the base; a second clamping electrode on the pivot platform;and a second clamp trace that connects the second clamp contact to thesecond clamping electrode.
 10. The micro pick up array mount of claim 1,further comprising: a second voltage source contact on the base; asecond electrostatic voltage source contact on the pivot platform totransfer a second operating voltage; a second source trace that connectsthe second voltage source contact to the second electrostatic voltagesource contact; a second clamp contact on the base; a second clampingelectrode on the pivot platform; and a second clamp trace that connectsthe second clamp contact to the second clamping electrode.
 11. A micropick up array mount comprising: a pivot platform; a base laterallyaround the pivot platform, wherein the pivot platform is movablerelative to the base; a plurality of beams physically coupled with thepivot platform and the base; a pair of voltage source contacts on thebase; a pair of electrostatic voltage source contacts on the pivotplatform to transfer operating voltages; a pair of source traces thatconnect the pair of voltage source contacts to the pair of electrostaticvoltage source contacts; a pair of clamp contacts on the base; a pair ofclamping electrodes on the pivot platform; and a pair of clamp tracesthat connect the pair of clamp contacts to the pair of clampingelectrodes.
 12. The micro pick up array mount of claim 11, wherein thepair of source traces and the pair of clamp traces run over theplurality of beams in a symmetric pattern.
 13. The micro pick up arraymount of claim 11, wherein the pivot platform, the base, and theplurality of beams comprise silicon.
 14. The micro pick up array mountof claim 11, further comprising a ribbon cable coupled to a voltagesource contact of the pair of voltage source contacts and a clampcontact of the pair of clamp contacts.